Product Overview:
The PHD series is a 2.0mm pitch wire-to-board connector system designed for modern high-density electronic devices. This series offers a complete interconnection solution with straight pins, right-angle pins, housings, and terminals, enabling reliable signal and power transmission in a compact space. Its design balances density, current-carrying capacity, and connection stability, making it an ideal choice for devices requiring miniaturization and high reliability.
Product Features:
Compact High-Density Design
The core features a 2.0mm pin pitch, accommodating more pins within the same width compared to traditional larger-pitch connectors, significantly saving PCB space and contributing to the miniaturization and high-density integration of electronic products.
Highly Reliable Connection Structure
The housing is equipped with robust guide grooves and locking mechanisms to ensure accurate mating and provide a clear locking feel, preventing accidental disconnection.
The terminals utilize a double-beam or four-point contact design, ensuring stable contact, long service life, and effective resistance to vibration and fretting corrosion.
Excellent Electrical and Mechanical Performance
The moderate-rated current (typically 3A-5A) meets the needs of most board-level power and signal transmission. The housing uses high-temperature flame-retardant materials, and the terminals have excellent conductivity and corrosion resistance, meeting stringent environmental reliability requirements. Convenient Assembly and Maintenance. The terminals support mature crimping processes for efficient wire connection, suitable for automated wire harness processing.
The user-friendly unlocking design facilitates insertion, removal, and maintenance in confined spaces.
Key Materials:
Housing: Made of UL 94 V-0 flame-retardant high-temperature resistant material (LCP/PA66), possessing excellent electrical insulation, heat resistance, and mechanical strength, ensuring stable operation in high-temperature environments.
Terminals: Made of high-elasticity, high-conductivity copper alloy, with tin or gold plating on the surface to achieve low contact resistance, good solderability, and excellent oxidation and corrosion resistance.
Typical Application Areas:
Industrial control and automation: Internal board-to-wire connections in PLC modules, servo drives, I/O modules, sensors, and human-machine interfaces (HMI). Communication and Network Equipment: Board-level power distribution and signal interconnection in routers, switches, optical modules, and base station radio frequency units.
Home Appliances and Smart Home Devices: Air conditioner controllers, high-end washing machine/refrigerator control boards, smart gateways, and other devices requiring reliable internal connections.
Automotive Electronics: Medium-density connections in non-engine compartment areas such as body control modules (BCM), infotainment systems, and instrument panels.
Medical and Security Electronics: Monitoring equipment, handheld terminals, camera modules, and other devices with dual requirements for space and reliability.
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